CFP: Phoenix Comicon Comic Art Conference (3/30; 5/27-30)

Call for papers

The Phoenix Comicon is sponsoring a comic art conference in conjunction with its programming from May 27-30, 2010. Based on participant interest, we are expanding the scope of the comics conference to include broader areas of comics scholarship.

We are seeking papers for presentations from academics, teachers, artists, retailers, and others who engage comics on either a practical or scholarly level. The conference will feature a number of themes, and respondents are encouraged to pitch their own ideas or propose a panel discussion.

Technology and the comics: Futures and Resistance

• Critical approaches to and innovations in web comics
• The shift from traditional illustration and distribution methods to digital methods
• Applications and analysis of “infinite canvas” texts
• Constrained comics and other resistance authors/artists

Comic culture in the 21st century

• Changes in how we sell, collect, and consume comics
• Scanlations and manga
• Teaching comics
• Cosplay and costuming

Media blending

• Video games and comics
• Movie and other adaptations
• Motion comics and other web-based media

Respondents are encouraged to expand on this list in shaping their proposals. Respondents are also encouraged to pitch alternate panels.

Graduate students, artists, writers, industry professionals, independent scholars, and academics are all encouraged to submit. We envision our panels as representing a variety of perspectives geared toward the broad audience of the Phoenix Comicon. Panels will last for one hour. Presenters will be asked to make a short presentation, followed by a moderated panel round table and a Q and A session with the audience. Presentations integrating audio and visuals are recommended. Please note any A/V needs along with your proposal.

Please submit a 300-500 word proposal to Dr. Kathleen Dunley at DrDunley@gmail.com by March 30, 2010. Proposals will go through a peer review process and those accepted will be notified via email.